in the above spec sheet, you will find our st andard product, please cont act your local manufacturing represent ative or call us direct to find out details of other options available regarding this style. please see our website for the most updated information! homep age: www .ebg.at & www .ebgusa.com / e-mail: sales@ebg.at & sales@ebgusa.com ebg austria - issue 31 1 / ebg resistors www .ebg.at www .ebgusa.com 30 power resistors series hxp 200, sot 227 200 w att power resistor in the ?isot op? power device due to a non inductive design these element s are ideally suited for high frequency and pulse load applications. by direct mounting on aheat sink significant cost advant ages can be realized. the type hxp can be supplied in a 2- terminal or 4-terminal version. even doubleresistors are available. main applications are: v ariable speed drives, power supplies, control devices, t elecom, robotics, motor controls and other switching designs. s pecials and custom designed component s on request. s pecifications ? resist ance range: 0.1 to 1m ? t olerance: 1%, 2%, 5%,10% ? t emperature coef ficient: 50, 100ppm, 250ppm (at+105c ref. to +25c) ? max. w ork.v olt age: 500v (up to 1,000v on special request) ? power rating at 85c:200w (see derating) ? short time overload: 1.25 x rated power @ 85c bottom case t emp. for 10sec, ? r = 0.4% max. (for conf. 1, 2 and 3) ? partial discharge:up to 2,000vrms/80 pc ? v olt age proof: dielectric s trength up to 4,000v dc against ground ? insulation resistance:10g min. @ 1kv dc ? isolation voltage betweenr1 and r2: 500v 1000v on special request ? protectionclass:acc. to iec 950/csa22.2 950/ m-89 and en 60950.88: 2 ? heat resist ance to cooling plate: r th <0.35 k/w ? capacitance/mass: 45pf ? serial inductivity: hxp-1 typical 40 nh ? w orking t emp. range: -55c to +155c ? max. t orque for base plate (st atic): 1.5 nm m4 screws ? max. t orque for cont act s (st atic): 1.3 nm. m4 screws ? for pulse power det ails, please see page 32 (datasheet uxp-300)! derating (thermal resistance):2.86w/k (0.35k/w). (for conf. 1, 2 and 3) best results can be reached by using athermal transfer compound with a heat conductivity of better than 1w/mk. the flatness of the cooling plate must be better than 0.05mm overall. the roughness of the surface should not exceed 6.4m. a 31.0 32.0 1.220 1.260 b 7.8 8.2 0.307 0.323 c 4.1 4.3 0.162 0.169 d 4.0 ? ? 0.158 ? ? e 4.1 4.3 0.162 0.169 f 14.9 15.1 0.587 0.595 g 30.1 30.3 1.186 1.193 h 37.7 38.3 1.484 1.508 j 1 1.8 12.2 0.465 0.481 k 8.9 9.1 0.351 0.359 l 0.75 0.85 0.030 0.033 m 12.6 12.8 0.496 0.504 n 24.4 25.4 0.960 1.001 o 1.95 2.05 0.077 0.081 p 5.3 ??? 0.209 ? ? dim. millimeters inches min. max. min. max. version 5: ohmic value between contact 2 and 4 = 3m ? ? configurations (p/p ackage) 200w200w 200w 2 x 80w 2 x 80w 2 1 1 4 2 r2 r1 r2 r1 1 3 4 3 4 1 2 31 4 2 1 2 3 4 5 160 40 100 80 0 60 20 40 0 25 50 75 100 125 150 175bottom-case temperature, c 200 0 80 120 rated power, w rated power, % r3 r2 4 3 6 r1 1 2 3 x 45w
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